Digital Humidity Sensor SHTW2 (RH/T)

Highest Performance At Smallest Power Budgets

The SHTW2 is Sensirion’s 2nd generation WLCSP (wafer-level chip-scale package) humidity sensor, offering a complete digital humidity and temperature sensor system in a package so tiny that it fits into virtually any application. The SHTW2 comes in a flip chip package, which is an established technology and represents one of the simplest and smallest possible ways of packaging for a semiconductor chip. With a footprint of 1.3 x 0.7 x 0.5 mm3 the SHTW2 is only one-seventh of the size of a comparable DFN humidity sensor, which opens up a new category of ultra-small humidity sensors and enables countless new opportunities for the Internet of Things, wearable and mobile markets.

The SHTW2 is based on Sensirion’s CMOSens® Technology, which offers a complete sensor system on a single chip, consisting of a capacitive humidity sensor, a band-gap temperature sensor, analog and digital signal processing, A/D converter, calibration data memory, and a digital communication interface supporting I2C fast mode.

The humidity sensor covers a humidity measurement range of 0 to 100 %RH and a temperature measurement range of –30°C to 100°C with a typical accuracy of ±3 % RH and ±0.3 °C. The operating voltage of 1.8 V and the low power consumption make the SHTW2 humidity sensor suitable for wearable applications running on the tightest power budgets. With the industry-proven quality and reliability of Sensirion’s humidity and temperature sensors and constant accuracy over a large measurement range, the SHTW2 humidity sensor offers an unprecedented price-performance ratio. Tape and reel packaging together with its suitability for standard SMD assembly processes make the SHTW2 predestined for high-volume applications.

Features

Interface I²C
Supply voltage 1.8 V
Power consumption 2µW (at 1 reading per second in low power mode)
Measuring range (RH) 0 – 100 % relative humidity
Measuring range (T) -30 to +100°C (-22 to +212°F)
Response time (RH) 8s (tau63%)
Package type Wafer-Level-Chip-Scale-Package (WLCSP)